OMRON Automation unveils X-ray inspection solution for power semiconductor industry
OMRON Automation demonstrated its expertise in Surface Mount Technology (SMT) and Through-hole Inspection solutions at the Productronica India 2024. The showcase was comprised of Automated X-ray Inspection (AXI), Automated Optical Inspection (AOI), Solder Paste Inspection (SPI) solutions.
One of the key exhibits was the company’s newest solution – OMRON 3DCT AXI – X850. This technology allows for comprehensive inspection of power semiconductors by leveraging advanced X-ray capabilities. It ensures reliable detection of defects, such as voids, insufficient solder, and misalignments, thereby enhancing overall product reliability and uniformity.
Elaborating more on the need of the solution, Sameer Gandhi, MD, OMRON Automation, India, said, “Semiconductor chips are central to various critical systems within EVs, impacting battery management systems (BMS), adaptive cruise control, and improving efficiency and safety. The trend towards faster charging, product miniaturisation, and increased horsepower has shifted from single-layer products to multi-layer ones, necessitating high inspection accuracy to identify defects at each layer ensuring they meet stringent quality standards, enhancing their reliability and performance in various applications.”
The showcase also had AOI systems that offer precise inspection capabilities for surface mount components, ensuring top-notch quality control in production processes and the SPI technology that delivers high-accuracy solder paste inspection, optimizing solder joint quality for electronics assembly.
